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MUNICH, Germany, 07.10. 2005 09:22
Reduces Cost, Increases Throughput up to 8X
SUSS Introduces New LED Wafer-Level Bonding Technology
SUSS MicroTec, AG introduces their new patent pending technology that performs simultaneous bonding of wafers, including eutectic processes to achieve impressive cost reduction while increasing throughput up to 8X. SUSS' new high throughput LED bonder has been accepted worldwide for applications including bonding of HIGH POWER and HIGH BRIGHTNESS LEDs.
The leading producers of HIGH BRIGHTNESS and HIGH POWER LEDs require cost reduction solutions. The SUSS LED bonder has been proven in production to be a cost reducing, yield improving, equipment set. "SUSS is dedicated to providing our customers with the best possible equipment. The design and marketing of the SB8eLED bonder is an indication of our commitment and leadership in proving wafer bonding solutions that do just that" said Mike Kipp, Wafer Bonder Division Manager.
Additionally this is the ideal equipment solution for the simultaneous temporary bonding of wafers to a carrier for subsequent WAFER THINNING.
High brightness LEDs are capable of matching conventional lighting, are smaller and longer lasting, are low in power consumption, and have a low thermal output. All of which helps our environment. SUSS is proud to play a role in this with our exciting new technology.
With its superior temperature and uniformity, precision bond tooling, and newly designed high alignment chamber, the SB8eLED bonder will surely be utilized in the production of other innovative products.
Kontaktinformationen:
Fiona Kemp, Corporate Communications Manager.
Tel: +49 (0)89 32007 395, Email:f.kemp@suss.de
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